Decapsulation system
ULTRA TEC ASAP-1
Bench-top digital machining system for decapsulation and polishing, designed for the preparation of integrated circuit (IC) samples.
Compatible with devices ranging from small SMD chips to large modules or sections of 300 mm wafers.
Technical specifications
Mechanical precision:
o Vertical motion (Z): minimum step 0.04 µm (40 nm).
o X and Y motion: minimum step 0.2 µm (200 nm).
Force control: up to 1000 g with 1 g precision.
Advanced measurement and compensation:
o RST system (Remaining Silicon Thickness): measures the remaining silicon thickness
without removing the sample.
3D modeling and adaptive meshing: compensates for surface curvature and ensures uniform
thinning.
Fluid and temperature control:
o Fluid Control System (FCS).
o Acclimation plate.
o Thermal Relaxation stage: stabilizes chip flatness; includes Peltier heating and cooling
modes as well as hot-plate operation.